We provide innovative, high-performance cleaning materials and application-specific engineering solutions to the semiconductor market. Our cleaning material solutions enable our customers to reduce defectivity, maximize yield, improve tool uptime, and reduce production costs.

Our product portfolio includes a wide array of advanced cleaning products that serve the front-end, wafer test, and back-end (advanced packaging) semiconductor manufacturing ecosystem. Our solutions are specifically tailored to keep pace with new technology nodes and address the evolving demands of our customer-base.

Custom surrogate package assemblies designed to clean various types of IC test sockets, necessary to maintain the performance, longevity, and reliability of test equipment.

Turn-key solution for maintaining performance, reliability, and longevity of testing equipment

• Precision engineered substrates and patented cleaning materials enable immediate installation, simplify maintenance, reduce downtime, and increase operational efficiency
• Compatibility with yield management software streamlines data management and improves quality control
• Regular cycling provides consistent and reliable socket performance minimizing the need for manual cleaning
• User defined recipes allow specific testing requirements for optimized device quality
• Customizable cleaning units that are tailored to match device enhances cleaning accuracy, improves test results, and reduces the risk of mis-contacts